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Metal Element Current Sense Resistor
ULR Series
* * * * * * Robust metal strip able to withstand high temperature and high current. Low TCR and Inductance Resistance Range from 0.5 m to 20 m Power ratings from 1W to 3W in 1206, 2010 and 2512 chip size Designed for current sense circuits in power electronic systems Higher wattage devices feature PCB clearance gap to maximize thermal performance
Electrical Data
IRC Type Coating1 Power rating at 80C (Watts) Standard Resistance Values (m)2 TCR Tolerance Dielectric (ppm/C) (%) Withstanding Voltage (Volts) 50 50 50 50 50 100 50 150 100 75 50 1, 5 200 1, 5 1, 5 100 100
1206 Chip Size
ULRG1 ULRG15 ULRG1 ULRG2 ULRG25 ULRG3 Green Green Green 1 1.5 1 2 2.5 3 1, 2, 3, 5, 7, 10 1, 2, 3, 5, 7, 10 11 - 20 7 - 10 4-6 0.5 - 0.75 1-3 2.5 - 3 ULRB1 ULRB2 Black 1 2 4-5 6-7 0.5 - 2
2010 Chip Size 2512 Chip Size
Notes: 1.Black coating = wave or IR reflow soldering; Green coating = IR reflow solder. Wave reflow - solder mask must match the W and D dimensions on page 2 of data sheet. 2Non-standard resistance values available (contact factory). For resistance values above 20 m, please refer to our LRC / LRF series. 3 Package sizes 2010 and 1206 with the green coating are uncoated on the top surface and unmarked for resistance value.
Environmental Data
Test
Short Term Overload (5x rated power for 5 seconds) Load at rated power (1000 hours cyclic load @ 70C) Temperatature Cycling (-55C to +150C; 1000 cycles) Dry Heat (+170C, no load; 1000 hours) Resistance to Solder Heat (260C for 10 seconds) Solderability (235C for 2 seconds) Resistance to Solvents Operating Temperature
General Note
IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC's own data and is considered accurate at time of going to print. Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com
R/R 0.5% + 0.5 m (black); R/R 1% (green) R/R 1% + 0.5 m (black); R/R 1% (green) R/R 0.5% + 0.5 m (black); R/R 1% (green) R/R 1% + 0.5 m (black); R/R 1% (green) R/R 0.5% + 0.5 m (black); R/R 1% (green) Minimum 95% coverage No deterioration of protective coating or marking -55C to 170C
Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA
A Subsidiary of TT electronics plc
ULR Issue July 2009 Sheet 1 of 6
Physical Data
D T W
L
Coating
Resistance Value (m) (1 Watt)
1 - 10
L
W
T
D
1206 Chip Size
Green
3.2 0.25
1.6 0.10
0.6 0.2
0.98 0.38
2010 Chip Size
Green
(1.5 Watt)
1 - 10 5.08 0.25 2.54 0.15 0.6 0.2 1.67 0.63
2512 Chip Size
(1 Watt, 2 Watt, 2.5 Watt, and 3 Watt)
0.5 0.75 1 - 1.5 2-3 4 5-6 7 8 - 20 0.5 0.75 1 1.5 1.4 0.2
1
2.68 0.25 2.48 0.25 1.43 0.25 6.35 0.25 3.0 0.2 0.6 0.2 1.18 0.25 2.18 0.25 1.93 0.25 1.43 0.25 1.18 0.25 1.0 0.2 1 0.8 0.2 1 0.65 0.2 1 6.35 0.25 3.18 0.25 0.5 0.2 1 0.85 0.2
1
Green
Black
2 2.5 3 4 5-7
1.43 0.38
0.7 0.2 1 0.6 0.2 1 0.5 0.2 1
Note:
1 Dimensions are for reference only
Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com
ULR Issue July 2009 Sheet 2 of 6
Electrical Connections
4-wire pad layout 2512 2-wire pad layout 2512 4-wire measurement points 5.4 2512
a
1.2 1.0 L unit: mm 4-wire pad layout 2010 unit: mm
a
L
3.45
1.5 0.5 Probe dia.
unit: mm 2010 4-wire measurement points 4.32 L
2-wire pad layout
2010
a
1.05 0.8 L unit: mm 1206
a
2.9
1.2 0.5 Probe dia. 1206
unit: mm 4-wire pad layout
unit: mm 1206 4-wire measurement points
2-wire pad layout
a
0.7 0.5 unit: mm L unit: mm
a
L 1.9 1.25 unit: mm
2.6
0.5 Probe dia.
Package 2512 - Black
Resistance (m-ohm) All 0.5 0.75 1 - 1.5 2-3 4 5-6 7 8 - 20
a 1.85 2.78 2.58 1.53 1.28 2.28 2.03 1.53 1.28
L 2.9 0.9 1.3 3.4 3.9 1.9 2.4 3.4 3.9
Package
Resistance (m-ohm) 1 2 3 4-5 6-8 9 - 10 1 2-3
a 2.04 1.74 1.24 2.04 1.74 1.49 1.3 0.8 1.3 1.1 0.8
L 1.2 1.8 2.8 1.2 1.8 2.3 0.8 1.8 0.8 1.2 1.8
2010
2512 - Green
1206
4-6 7-9 10
Note:
1 Green parts require the use of "D" dimensions on page 2 for parts being assembled in a wave reflow processes.
Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com
ULR Issue July 2009 Sheet 3 of 6
Construction
Black Type
A low TCR resistance alloy plate with plated connection bands is protectively coated and numerically marked with the resistance value, as described in Product Marking. This version has standard plated connection and is suitable for wave or IR reflow soldering processes.
Green Type
A low TCR alloy plate is grooved to set the final resistance. The lower faces are solder plated for connections, and the top surface is protectively coated and numerically marked with the resistance value, as described in Product Marking. This part is suitable for wave and IR reflow soldering processes. Wave reflow requires the solder mask to be dimensioned according to page 2 using the W and D dimensions of the part.
Power Derating Curve
Note:
Rated Power (%)
100
50
0 0 85 170
The power derating curve is a guidance based on a conservative design model. The ULR is a solid metal alloy construction that can withstand significantly greater operating temperatures than the conservative model permits. The protective coating will operate up to 260C and the alloy can withstand in exess of 350C. Therefore, the system thermal design will be a more significant design parameter due to the heat limitations of the solder joint.
Ambient Temperature (C)
Plastic Tape Specification
Top Tape D A B
0
E F W
T Emboss Tape
Resistor
P1
P2
P0
D direction of unreeling
1
1.4Min.
Size
2512 2010 1206
Resistance (m)
0.5 - 7 0.5 - 20 1 - 10
A
3.40.1 2.850.1
B
6.730.1 6.750.1 5.550.1
W
120.1 120.1
E
1.750.1 1.750.1 1.750.1
F
5.50.05 5.50.05 3.50.05
P0
40.1 40.1 40.1
P1
40.1 40.1 40.1
P2
20.05 20.05 20.05
D0
1.5+0.1, -0 1.5+0.1, -0 1.550.05 1.550.05
T
0.810.1 0.800.1 0.850.1 0.870.1
1 - 10
1.90.1
3.60.1
80.2
Note:
1. 2. 3. 4. 5. The cumulative tolerance of 10 sprocket hole pitch is 0.2 mm. Carrier camber shall not be more than 1 mm per 100 mm through a length of 250 mm. A & B measured 0.3 mm from the bottom of the packet. T measured at a point on the inside bottom of the packet to the top surface of the carrier. Pocket position relative to sprocket hole is measured as the true position of the pocket and not the pocket hole.
ULR Issue July 2009 Sheet 4 of 6
* 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com
Wire and Film Technologies Division
IRC Solder Reflow Recommendations
Sn-Pb Eutectic and Pb-Free Reflow Profiles
tP TP
Ramp-up Critical Zone TL to TP
TL
Temperature
Tsmax
tL
Tsmin ts Preheat
Ramp-down
25
t 25C to Peak
Time
* Based on Industry Standards and IPC recommendations
Profile Feature
Average Ramp-up rate (Tsmax to Tp) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) Time maintained above - Temperature (TL) - Time (tL) Peak Temperature (TP) Ramp-down Rate Time 25C to Peak Temperature Time within 5C of actual Peak Temperature (tp)2
Sn-Pb Eutectic Assembly
3C / second max. 100C 150C 60 -120 seconds 183C 60 - 150 seconds See Table 1 10 - 30 seconds 6C / second max. 6 minutes max.
Pb-Free Assembly
3C / second max. 150C 200C 60 -180 seconds 217C 60 - 150 seconds See Table 2 20 - 40 seconds 6C / second max. 8 minutes max.
Note 1: All temperatures refer to topside of the package, measured on the package body surface. Note 2: Time within 5 C of actual peak temperature (tp) specified for the reflow profiles is a "supplier" minimum and a "user" maximum.
Tabel 1: SnPb Eutectic Process Package Peak Reflow Temperatures
Package Thickness < 2.5 mm 2.5 mm Volume mm3 < 350 240 +0/-5C 225 +0/-5C Volume mm3 350 225 +0/-5C 225 +0/-5C
Note 1: Package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks. Note 2: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processess reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. Note 3: Components intended for use in "leadfree" assembly process shall be evaluated using the "lead-free" peak temperature and profiles defined in Table 1, 2 and reflow profile whether or not lead-free.
Tabel 2: Pb-free Process Package Peak Reflow Temperatures
Package Thickness < 1.6 mm 1.6 mm - 2.5 mm 2.5 mm Volume mm3 < 350 260C * 260C * 250C * Volume mm3 350 - 2000 260C * 250C * 245C * Volume mm3 > 2000 260C * 245C * 245C *
* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature at the rated MSL level.
* 4222 South Staples Street * Corpus Christi Texas 78411 USA Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com
Wire and Film Technologies Division
ULR Issue July 2009 Sheet 5 of 6
Packaging Quantity
Series Emboss Plastic Tape
2512 2010 1206
2,000 2,000 2,000
Ordering Data
Specify type, resistance, tolerance, ROHS compliance and packaging. Example: Metal Element Current Sense Resistor, 1-watt, 10 m resistor. Sample Part No. ULR G 1 2512 R010 F LF SLT
IRC Type Coating Color Code G = Green, B = Black Power Rating (see specs table) Package Size Resistance Value (EIA 4-digit code) Example: 0.010 = R010 Tolerance (EIA format) F = 1% J = 5% RoHS - Compliance LF = RoHS compliant Construction Packaging SLT = Standard Lead Tape
Product Marking
Part resistance is indicated by using two marking notation syles: * 4-digit: R002 = 2 m; R designates the decimal location in ohms. * 3-digit: 1M5 = 1.5 m; M designates the decimal location in milliohm.
Wire and Film Technologies Division * 4222 South Staples Street * Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 * Facsimile: 361 992 3377 * Website: www.irctt.com
ULR Issue July 2009 Sheet 6 of 6

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